IPCWorks Asia 2007

Date: October 15-16, 2007
Venue: Shenzhen China

Organizer: IPC and IPC Shanghai            Creativity Convention & Exhibition (Shenzhen) Co.Ltd A New Technical Conference is Here! IPC is announcing a new conference in southern China in conjunction with Elexcon part of the enormously successful China Hi-Tech Fair held in Shenzhen each year.  IPC Works Asia will bring the technical excellence of the IPC along with technical committee activities that have been in place at IPC meetings for 50 years. You are invited to get in on the ground floor of this inaugural industry event.   Presentations from technical experts are sought on all relevant subjects, including: Lead Free Implementation ·         Printed Board Solderability ·         Solder Joint Reliability ·         Tin Whiskers   Board Fabrication ·         Advances in Plating Technology ·         Advances in Flex and Rigid-Flex ·         Via Fill Technology   Board Design ·         Embedded Passives ·         Advances in CAD/CAM ·         Fine Pitch Design Assembly Technology ·         BGA Attachment Reliability ·         Rework and Repair ·         No Clean Processes   Board Materials ·         New Laminates ·         Materials Testing ·         High Frequency Laminates   Benefits of Participating Increase your visibility in the industry, and that of your company, by participating in the IPCWorks Asia 2007 technical conference. Many industry leaders use the research and findings from conference proceedings when they develop industry standards and guidelines.   Technical Presentations and/or Papers The Technical Conference will be held Monday and Tuesday October 15-16, 2007. Abstracts for unpublished work should be submitted detailing case histories, field data, new technologies or innovations or research and findings. In addition, abstracts should summarize the problems and resolutions, methods used results of experiments and benefits to the industry.   Presentations at the conference may be thirty minutes in length. They may be grouped together in a forum or panel discussion.   Presentations must be non-commercial in nature, focusing on technology rather than a company’s product. Those deemed commercial by the Technical Program Committee will not be accepted. Abstracts must be submitted by July 18, 2007. Professional Development Courses Proposals are solicited from individuals interested in teaching full-day (six hours) or half-day (three hours) Professional Development Courses on design, printed circuit board and electronic manufacturing processes and materials.   Proposals including course descriptions must be submitted by July 18, 2007. A master copy of the course workbook must be submitted by September 14, 2007. An honorarium is offered to Professional Development Instructors. Contact Alexandra Curtis at +1 847-597-2877. Proceedings Please note: It is mandatory for all speakers and instructors to provide an electronic copy of their technical paper and/or presentation slides. The deadline for paper/visuals submission is September 14, 2007. Conference Speaker Benefits All conference speakers at IPCWorks Asia 2007, will receive free conference admission and a complimentary copy of the conference Proceedings on CD.  15-16. OCT, 2007          Grand Meeting Room，4th Floor, Shenzhen Int’l Chamber of Commerce Tower

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